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revisions ltr description date (yr -mo - da) approved a add packages t and w. add vendor cage 60395 as source of supply. increase data retention to 20 years, minimum. redrawn with changes. 93-06 -29 m. a. frye b changes in accordance with nor 5962 - r139- 94. 94-03 -29 m. a. frye c changes in accordance with nor 5962 -r2 7 8 - 94. 94-09 -19 m. a. frye d changes in accordance with nor 5962 - r163- 96. 96-06 -27 m. a. frye e updated boilerplate. added device types 16 - 18 and packages m and n to drawing along with vendor cage 0eu86 as supplier. removed figures 9, 10 and 11 software data protect algorithms. removed vendor 61395 as supplier. - glg 98-07 -22 raymond monnin f corrected dimensions for packages "m" and "n". - glg 99-10 -06 raymond monnin g added device 19, packages 6 and 7, and updated boilerplate. ksr 01-10 -05 raymond monnin h 5 year review, updated boilerplate paragraphs. ksr 06-05 -1 5 raymond monnin j update drawing to meet current mil - prf - 38535 requirements . - glg 14 - 12 - 1 0 charles saffle the original first page has been replaced. rev j j sheet 35 36 rev j j j j j j j j j j j j j j j j j j j j sheet 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 rev status rev j j j j j j j j j j j j j j of sheets sheet 1 2 3 4 5 6 7 8 9 10 11 12 13 14 pmic n/a prepared by kenneth rice dla land and maritime columbus, ohio 43218 - 3990 http://www.landandmaritime.dla.mil standard microcircuit drawing checked by charles reusing this drawing is available for use by all departments and agencies of the department of defense approved by charlie besore microcircuit, memory, digital, cmos 128k x 8 bit eeprom, monolithic silicon drawing approval date 91- 07 - 12 amsc n/a revision level j size a cage code 67268 5962 - 38267 sheet 1 of 36 dscc form 2233 apr 97 5962 -e 090-15
1. scope 1.1 scope . this drawing documents two product assurance class levels consisting of high reliability (device classes q and m) and space application (device class v). a choice of case outlines and lead finishes are available and are reflected in th e part or identif ying number (pin). when available, a choice of radiation hardness assurance (rha) levels are reflected in the pin. 1.2 pin . the pin is as shown in the following example: 5962 - 38267 01 m x a | | | | | | | | | | | | | | | | | | federal rha device device case lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) \ / (see 1.2.3) \ / drawing number 1.2.1 rha designator . device classes q and v rha marke d devices meet the mil - prf - 38535 specified rha levels and are marked with the appropriate rha designator. device class m rha marked devices meet the mil - prf - 38535, appendix a specified rha levels and are marked with the appropriate rha designator. a dash (- ) indicates a non- rha device. 1.2.2 device type(s) . the device type(s) identify the circuit function as follows: software generic data device type number circuit function access time write speed write mode endurance protect 01 ,16 1 / 128k x 8 eeprom 250 ns 10 ms byte/page 10,000 cycle yes 02 128k x 8 eeprom 250 ns 5 ms byte/page 10,000 cycle yes 03,17 128k x 8 eeprom 200 ns 10 ms byte/page 10,000 cycle yes 04 128k x 8 eeprom 200 ns 5 ms byte/page 10,000 cycle yes 05,18 128k x 8 eeprom 150 ns 10 ms byte/page 10,000 cycle yes 06 128k x 8 eeprom 150 ns 5 ms byte/page 10,000 cycle yes 07,19 128k x 8 eeprom 120 ns 10 ms byte/page 10,000 cycle yes 08 128k x 8 eeprom 120 ns 3 ms byte/page 10,000 cycle yes 09 128k x 8 eeprom 90 ns 10 ms byte/page 10,000 cycle yes 10 128k x 8 eeprom 90 ns 3 ms byte/page 10,000 cycle yes 11 128k x 8 eeprom 70 ns 10 ms byte/page 10,000 cycle yes 12 128k x 8 eeprom 70 ns 3 ms byte/page 10,000 cycle yes 13 128k x 8 eeprom 120 ns 3 ms byte/page 10,000 cycle yes 14 128k x 8 eeprom 90 ns 3 ms byte/page 10,000 cycle yes 15 128k x 8 eeprom 70 ns 3 ms byte/page 10,000 cycle yes 1.2.3 device class designator . the device class designator is a single letter identifying the product assurance level as follows: d evice class device requirements documentation m vendor self - certification to the requirements for mil- std - 883 compliant, non- jan class level b microcircuits in accordance with mil - prf - 38535, appendix a q or v certification and qualification to mil - prf - 38535 1 / generic numbers are listed on the standard microcircuit drawing source approval bulletin at the end of this document and will also be listed in qml - 38535 and mil- hdbk -103. standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 2 dscc form 2234 apr 97
1.2.4 case outline(s) . the case outline(s) shall be as designated in mil - std - 1835 and as follows: outline letter descriptive designator terminals package style x gdip1 - t32 or cdip2- t32 32 dual in - line y cqcc1 - n44 44 square chip carrier z see figure 1 32 flat package u cqcc1 - n32 32 rectangular chip carrier t see figure 1 30 grid array w see figure 1 36 grid array m see figure 1 32 flat package n see figure 1 32 flat package 6 see figure 1(enhanced rad tolerant) 32 flat package 7 see figure 1(enhanced rad tolerant) 32 flat package 1.2.5 lead finish . the lead finish is as specified in mil - prf - 38535 for device classes q and v or mil- prf - 38535, appendix a for device class m. 1.3 absolute maximum ratings . 2 / 3 / supply voltage range (v cc ) ......................................................... - 0.5 v dc to +6.0 v dc 4 / operating case temperature range ............................................... -55 c to +125 c storage temperature range ........................................................... -65 c to +150 c lead temperature (soldering, 10 seconds) ................................... +300c thermal resistance, junction -to - case ( jc ): cases x, y and u ....................................................................... see mil- std - 1835 cases t and w ........................................................................... 21 c/w 5 / case z ........................................................................................ 18 c/w 5 / case m ....................................................................................... 3 c/w 5 / case n ....................................................................................... 2 c/w 5 / case 6 ........................................................................................ 1.5 c/w 5 / case 7 ........................................................................................ 1.5 c/w 5 / maximum power dissipation (p d ) ................................................. 1.0 watts junction temperature (t j ) ............................................................. +175c 6 / endurance .................................................................................... 10,000 cycles/byte (minimum) data retention ............................................................................... 20 years minimum 1.4 recommended operating conditions . supply voltage range (v cc ) ......................................................... 4.5 v dc minimum to 5.5 v dc maximum supply voltage (v ss ) ................................................................... 0.0 v dc high level input voltage range (v ih ) ............................................. 2.0 v dc to v cc + 1.0 v dc 7 / low level input voltage range (v il ) .............................................. - 0.1 v dc to 0.8 v dc case operating temperature range (t c ) ....................................... -55 c to +125 c 1.5 digital logic testing for device classes q and v . fault coverage measurement of manufacturing logic tests (mil - std - 883, test method 5012) ............................. 100 percent 2 / stresses above the absolute maximum rating may cause permanent damage to the devic e. extended operation at the maximum levels may degrade performance and affect reliability. 3 / all voltages referenced to v ss (v ss = ground), unless otherwise specified. 4 / negative undershoots to a minimum of - 1.0 v are allowed with a maximum of 20 ns pulse width. 5 / when the thermal resistance for this case is specified in mil - std - 1835, that value shall supersede the value indicated herein. 6 / maximum junction temperature shall not be exce eded except for allowable short duration burn - in screening conditions in accordance with method 5004 of mil - std -883. 7 / for device types 16 - 19 only, v ih on res shall be v cc - 0.5 v min. to v cc + 1.0 v max. standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 3 dscc form 2234 apr 97
2. applicable documents 2.1 government specification, standards, and handbooks . the following specification, standards, and handbooks form a part of this drawing to the extent specified herein. unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. department of defense specification mil - prf - 38535 - integrated circuits, manufacturing, general specification for. department of defense standards mil - std -883 - test method standard microcircuits. mil - std -1835 - interface standard electronic component case outlines. department of defense handbooks mil - hdbk - 103 - list of standard microcircuit drawings. mil - hdbk - 780 - standard microcircuit drawings. (copies of these documents are availab le online at http://quicksearch.dla.mil or from the standardization document order desk, 700 robbins avenue, building 4d, philadelphia, pa 19111 - 5094.) 2.2 non - government publications . the following document(s) form a part of this document to the extent specified herein. unless otherwise specified, the issues of the documents are the issues of the documents cited in the solicitation. american society for testing and materials (astm) astm standard f 1192 - standard guide for the measurement of single event phenomena from heavy ion irradiation of semiconductor devices. (applications for copies of astm publications should be addressed to: astm international, po box c700, 100 barr harbor drive, west conshohocken, pa 19428 - 2959; http://www.astm.org .) jedec solid state technology association (jedec) jesd 78 - ic latch - up test. ( copies of this document are available on line at http://www.jedec.org or from jedec - solid state technology association, 3103 north 10 th street , suite 247, arlington, va 22201;) (non - government standards and other publications are normally available from the organizations that prepare or distribute the documents. these documents also may be available in or through libraries or other informational services.) 2.3 order of precedence . in the event of a conflict between the text o f this drawing and the references cited herein, the text of this drawing takes precedence. nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. requirements 3.1 item requirem ents . the individual item requirements for device classes q and v shall be in accordance with mil - prf - 38535 and as specified herein or as modified in the device manufacturer's quality management (qm) plan. the modification in the qm plan shall not affec t the form, fit, or function as described herein. the individual item requirements for device class m shall be in accordance with mil - prf - 38535, appendix a for non- jan class level b devices and as specified herein. 3.2 design, construction, and physica l dimensions . the design, construction, and physical dimensions shall be as specified in mil - prf - 38535 and herein for device classes q and v or mil- prf - 38535, appendix a and herein for device class m. 3.2.1 case outline(s) . the case outline(s) shall b e in accordance with 1.2.4 herein and figure 1 . 3.2.2 terminal connections . the terminal connections shall be as specified on figure 2 . standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 4 dscc form 2234 apr 97
3.2.3 truth table(s) . the truth table(s) shall be as specified on figure 3 . 3.2.3.1 unprogrammed devices . the truth table for unprogrammed devices for contracts involving no altered item drawing shall be as specified on figure 3 herein. when required, in screening (see 4.2 herein), or quality conformance inspection gr oups a, b, c, or d (see 4.4 herein), th e devices shall be programmed by the manufacturer prior to test in a checkerboard or similar pattern (a minimum of 50 percent of the total number of bits programmed). 3.2.3.2 programmed devices . the requirements for supplying programmed devices are not part of this document. 3.3 electrical performance characteristics and postirradiation parameter limits . unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table i and s hall apply over the full case operating temperature range. 3.4 electrical test requirements . the electrical test requirements shall be the subgroups specified in table iia. the electrical tests for each subgroup are defined in table i. 3.5 marking . the part shall be marked with the pin listed in 1.2 herein. in addition, the manufacturer's pin may also be marked. for packages where marking of the entire smd pin number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962 - " on the device. for rha product using this option, the rha designator shall still be marked. marking for device classes q and v shall be in accordance with mil - prf - 38535. marking for device class m shall be in accordance with mil - prf - 38535, appendix a. 3.5.1 certification/compliance mark . the certification mark for device classes q and v shall be a "qml" or "q" as required in mil - prf - 38535. the compliance mark for device class m shall be a "c" as required in mil- prf - 38535, append ix a. 3.6 certificate of compliance . for device classes q and v, a certificate of compliance shall be required from a qml - 38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). for device class m, a certif icate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in mil - hdbk - 103 (see 6.6.2 herein). the certificate of compliance submitted to dla land and maritime - va prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes q and v, the requirements of m il - prf - 38535 and herein or for device class m, the requirements of mil- prf - 38535, appendix a and herein. 3.7 certificate of c onformance . a certificate of conformance as required for device classes q and v in mil - prf - 38535 or for device class m in mil- prf - 38535, appendix a shall be provided with each lot of microcircuits delivered to this drawing. 3.8 notification of change for device class m . for device class m, notification to dla land and maritime - va of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 verification and review for devi ce class m . for device class m, dla land and maritime , dla land and maritime 's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. of fshore documentation shall be made available onshore at the option of the reviewer. 3.10 microcircuit group assignment for device class m . device class m devices covered by this drawing shall be in microcircuit group number 42 (see mil - prf - 38535, appendix a). 3.11 processing of eeproms . all testing requirements and quality assurance provisions herein shall be satisfied by the manufacturer prior to delivery. 3.11.1 conditions of the supplied devices . devices will be supplied in an unprogrammed or clear state. no provision will be made for supplying programmed devices. 3.11.2 erasure of eeproms . when specified, devices shall be erased in accordance with procedures and characteristics specified in 4.5.1. 3.11.3 programming of eeproms . when specified, devices shall be programmed in accordance with procedures and characteristics specified in 4.5.2. 3.11.4 verification of state of eeproms . when specified, devices shall be verified as either written to the specified pattern or cleared. as a minimum, verification shall consist of per forming a read of the entire array to verify that all bits are in the proper state. any bit that does not verify to be in the proper state shall constitute a device failure and the device shall be remo ved from the lot or sample. standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 5 dscc form 2234 apr 97
3.11.5 power supply sequ ence of eeproms . in order to reduce the probability of inadvertent writes, the following power supply sequences shall be observed. a. for device types 1 - 19, a logic high state shall be applied to we and/or ce at the same time or before the application of v cc . for device types 16 - 19, an additional precaution is available; a logic low state shall be applied to res at the same time or before the application of v cc . b. for device types 1 - 19, a logic high state shall be applied to we and/or ce at the same time or before the removal of v cc . for device types 16 - 19, an additional precaution is available; a logic low state shall be applied to res at the same time or before the removal of v cc . 3.12 endurance . a reprogrammability test shall be completed as part of the vendor's reliability monitors. this reprogrammability test shall be done for initial characterization and after any design or process changes which may affect the reprogrammability of the device. the methods and procedures may be vendor specific, but shall guarantee the number of program/erase endurance cycles listed in section 1.3 herein over the full military temperature ra nge. the vendor's procedure shall be kept under document control and shall be made available upon request of the acquiring or preparing activity, along with test data. 3.13 data retention . a data retention stress test shall be completed as part of the vendor's reliability monitors. this test shall be done for initial characterization and after any design or process change which may affect data retention. the methods and procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein over the full military temperature range. the vendor's procedure shall be kept under document control and shall be made available upon request of the acquiring or preparing activity, along with test data. standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 6 dscc form 2234 apr 97
table i. electrical performance characteristics . test symbol conditions -55c t c +125 c v ss = 0 v; 4.5 v v cc 5.5 v unless otherwise specified group a subgroups device type limits unit min max high level input current i ih v cc = 5.5 v, v in = 5.5 v 1,2,3 all -5 5 a low level input current i il v cc = 5.5 v, v in = 0.1 v 1,2,3 all -5 5 a for res input 16-19 -100 100 high impedance output leakage current 1 / i ozh v ih oe v cc 1,2,3 all -10 10 a v cc = 5.5 v, v o = 5.5 v i ozl v ih oe v cc 1,2,3 -10 10 v cc = 5.5 v, v o = 0.0 v output high voltage v oh i oh = -400 a, v cc = 4.5 v 1,2,3 all 2.4 v v ih = 2.0 v, v il = 0.8 v output low voltage v ol i ol = 2.1 ma, v cc = 4.5 v 1,2,3 all 0.4 v v ih = 2.0 v, v il = 0.8 v input high voltage 2 / v i h v cc = 5.5 v 1,2,3 01-15 2.0 6.0 v 16 - 19 2. 2 6.0 input low voltage 2 / v il v cc = 4.5 v 1,2,3 all - 0.5 0.8 v oe high voltage v h 1,2,3 01-15 1 2 1 3 v res high voltage 16-19 v cc - 0.5 v cc +1.0 operating supply current i cc1 v cc = 5.5 v, we = v ih , ce = oe = v il f = 1/t avav min 1,2,3 01 - 06, 08- 13, 16,17 8 0 ma 07,18,19 100 09 - 12, 14,15 120 standby supply current ttl i cc2 v cc = 5.5 v, ce = v ih , all i/o's = open, oe = v il , f = 0 hz 1,2,3 all 3 ma standby supply current cmos i cc3 v cc = 5.5 v, ce = v cc - 0.3 v inputs = v ih , i/o's = open, oe = v il , f = 0 hz 1,2,3 01 - 07 85 0 a 08 - 12 500 13 - 15, 16-19 350 see footnotes at end of table. standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 7 dscc form 2234 apr 97
table i. electrical performance characteristics - continued . test symbol conditions -55c t c +125 c v ss = 0 v; 4.5 v v cc 5.5 v unless otherwise specified group a subgroups device type limits unit min max input capacitance 3 / 4 / c in v in = 0 v, f = 1.0 mhz, 4 all 10.0 pf t c = +25 standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 8 dscc form 2234 apr 97
table i. electrical performance characteristics - continued . test symbol conditions -55c t c +125 c v ss = 0 v; 4.5 v v cc 5.5 v unless otherwise specified group a subgroups device type limits unit min max oe to output in low z 4 / t olqx see figures 4 , 5 , and 6 as applicable. 5 / 9, 10, 11 all 0 ns output disable to output in high z 4 / t ohqz 9, 10, 11 01 - 06 55 ns 07 - 19 50 output hold from address change t axqx 9, 10, 11 all 0 ns write cycle time t whwl1 t ehel1 9, 10, 11 01,03, 05,07, 09,11, 1 6 ,1 9 10 ms 02,04, 06 5 08 ,10, 12 - 15 3 address setup time t avwl t avel 9, 10, 11 all 0 ns address hold time t wlax t elax 9, 10, 11 16-19 1 50 ns 01 - 08, 13 70 09 - 12 14,15 50 write setup time t elwl t wlel 9, 10, 11 all 0 ns write hold time t wheh t ehwh 9, 10, 11 all 0 ns oe setup time t ohwl t ohel 9, 10, 11 01 - 15 10 ns 16 - 19 0 oe hold time t whol t ehol 9, 10, 11 01 - 15 10 ns 16 - 19 0 write pulse width (page or byte write) t wlwh t eleh 9, 10, 11 01 - 15 1 0 0 n s 16 - 19 250 data setup time t dv wh t dv eh 9, 10, 11 16 - 19 100 n s 01 - 08, 13 6 0 09 - 12 14,15 40 see footnotes at end of table. standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 9 dscc form 2234 apr 97
table i. electrical performance characteristics - continued . test symbol conditions -55c t c +125 c v ss = 0 v; 4.5 v v cc 5.5 v unless otherwise specified group a subgroups device type limits unit min max data hold time t whdx t ehdx see figures 4, 5, and 6 as applicable. 5 / 9, 10, 11 01 - 07 16 - 19 10 ns 08 - 15 0 byte load cycle t whwl2 9, 10, 11 01 - 15 . 20 149 s 16 - 19 .3 30 last byte loaded to data polling t whel t ehel 9, 10, 11 01 - 02,16 250 ns 03 - 04,17 200 05 - 06,18 15 0 07,08,13, 19 120 0 9 , 10 ,14 9 0 11,12 , 15 7 0 ce setup time (chip erase) t elwl see figures 4 , 5, and 6 as applicable. 5 / 6 / 9, 10, 11 all 5 s oe setup time (chip erase) t ovhwl 9, 10, 11 all 5 s we pulse width (chip clear) t wlwh2 9, 10, 11 01-07 10 ms 08 - 15 10 s ce hold time (chip erase) t wheh 9, 10, 11 all 5 s oe hold time (chip erase) t whoh 9, 10, 11 all 5 s high voltage (chip erase) v h 9, 10, 11 all 12 13 v clear recovery (chip erase) t olel 9, 10, 11 all 50 ms data setup time (chip erase) 7 / t dhwl 9, 10, 11 all 1 s data hold time during chip erase cycle 7 / t whdx 9, 10, 11 all 1 s see footnotes on next page. standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 10 dscc form 2234 apr 97
table i. electrical performance characteristics ? continued. test symbol conditions -55c t c +125 c v ss = 0 v; 4.5 v v cc 5.5 v unless otherwise specified group a subgroups device type limits unit min max res low to output float t dfr see figures 4, 5, and 6 as applicable. 5 / 8 / 9, 10, 11 16-19 0 350 ns res to output delay t rr 9, 10, 11 16-19 0 450 ns reset protect time t rp 9, 10, 11 16-19 100 ns reset high time t res 9, 10, 11 16-19 1. 0 ns time to device busy t db 9, 10, 11 16-19 120 ns 1 / connect all address inputs and oe to v ih and measure i ozl and i ozh with the output under test connected to v out . terminal conditions for the output leakage current test shall be as follows: a. v ih = 2.0 v for device types 01 - 15 and 2.2 v for device types 16- 19; v il = 0.8 v. b. for i ozl : select an appropriate address to acquire a logic "1" on the designated output. apply v ih to ce . measure the leakage cu rrent while applying the specified voltage. c. for i ozh : select an appropriate address to acquire a logic "0" on the designated output. apply v ih to ce . measure the le akage current while applying the specified voltage. 2 / a functional test shall verify the dc input and output levels and applicable patterns as appropriate, all input and i/o pi ns shall be tested. terminal conditions are as follows: a. inputs: h =2.0 v for device types 01 - 15 and 2.2 v for device types 16- 19; l = 0.8 v. outputs: h = 2.4 v minimum and l = 0.4 v maximum. b. the functional tests shall be performed with v cc = 4.5 and v cc = 5.5 v. 3 / all pins not being tested are to be open. 4 / tested initially and after any design or process changes which may affect that parameter, and therefore shall be guarantee d to the limits specified in table i. 5 / tested by application of specified timing signals and conditions. equivalent ac test conditions: output load, see figure 5; input rise and fall times 10 ns; input pulse levels, 0.4 v and 2.4 v; timing measurement reference levels, inputs, 1.5 v for device types 1 - 15 and 1 v and 2 v for device types 16 - 19; outputs, 1.5 v for device types 1 - 15 and 0.8 v and 2 v for device types 16-19. 6 / chip erase f unctions are applicable to device types 01 - 15 only. 7 / this parameter not applicable for internal timer controlled devices. 8 / res functions are applicable to device types 16 - 19 only. standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 11 dscc form 2234 apr 97
case t figure 1. case outline . standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 12 dscc form 2234 apr 97
case w figure 1. case outline ? continued. standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 13 dscc form 2234 apr 97
case z figure 1. case outline ? continued. standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 14 dscc form 2234 apr 97
case z variations (all dimensions shown in inches) symbol min max notes a b c d e e1 e2 e3 .090 .015 .004 .430 .330 .030 .120 .020 .007 ..830 .488 .498 4 8 e .050 bsc h k .008 1.228 .015 2, 5 k1 .025 ref 2, 5 l q s1 .270 .026 .370 .045 .045 3 n 32 6 inches mm | inches mm | inches mm .004 0.10 | .020 0.51 | .270 6.86 .005 0.13 | .025 0.64 | .350 8.89 .006 0.15 | .026 0.66 | .370 9.40 .007 0.18 | .030 0.76 | .472 11.99 .008 0.20 | .045 1.14 | .488 12.40 .015 0.38 | .050 1.27 | .498 12.65 .019 0.48 | .120 3.05 | 1.228 31.19 notes: 1. all dimensions and tolerances conform to ansi y14.5m - 1982. 2. index area: an identification mark shall be located adjacent to pin 1 within the shaded area shown. al ternatively, a tab (dim k) may be used as shown. 3. dimension q shall be measured from the point on the lead located opposite the braze pad. 4. this dimension includes lid thickness. 5. optional, see note 2. if pin 1 identification is used instead of this tab, the minimum dimension does not apply. 6. (n) indicates number of leads. 7. uses a metal lid. 8. includes braze fillet. 9. metric equivalents are given for general information only. figure 1. case outline ? continued. standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 15 dscc form 2234 apr 97
case m figure 1. case outline ? continued. standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 16 dscc form 2234 apr 97
case m variations symbol millimeters inches min max min max a a1 b c d d2 e e1 2.46 2.29 .038 0.08 20.57 18.92 10.80 8.38 3.12 2.79 .048 0.18 21.08 19.18 11.30 9.04 .097 .090 .015 .003 .810 .745 .425 .330 .123 .110 .019 .007 .830 .755 .445 .356 e 1.14 1.40 .045 .055 h 25.40 27.94 1.00 1.10 l q 7.37 0.66 7.87 0.94 .290 .026 .310 .037 n 32 note: although dimensions are in inches, the us government preferred system of measurement is the metric si system. however, since this item was originally designed using inch - pound units of measurement, in the event of conflict between the two, the inch - pound units shall take precedence. metric equivalents are for general information only. figure 1. case outline ? continued. standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 17 dscc form 2234 apr 97
case n figure 1. case outline ? continued. standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 18 dscc form 2234 apr 97
case n variations symbol millimeters inches min max min max a a1 b c d d1 d2 e e1 3.18 2.29 0.38 0.08 20.57 19.69 18.92 10.80 7.37 3.81 2.79 0.48 0.18 21.08 19.94 19.18 11.30 7.87 .125 .090 .015 .003 .810 .775 .745 .425 .290 .150 .110 .019 .007 .830 .785 .755 .445 .310 e 1.14 1.40 .045 .055 h 25.40 27.94 1.00 1.10 l q 7.37 0.66 7.87 0.94 .290 .026 .310 .037 n 32 note: although dimensions are in inches, the us government preferred system of measurement is the metric si system. however, since this item was originally designed using inch - pound units of measurement, in the event of conflict between the two, the inch - pound units shall take precedence. metric equiv alents are for general information only. figure 1. case outline ? continued. standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 19 dscc form 2234 apr 97
case 6 figure 1. case outline ? continued. standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 20 dscc form 2234 apr 97
case 6 variations symbol millimeters inches min max min max a b c d e e1 e2 e3 3.07 0.38 0.10 11.99 7.72 0.76 3.81 0.56 0.18 21.08 12.40 7.87 .121 .015 .004 .472 .304 .030 .150 .022 .009 .830 .488 .498 e 1.27 .050 bsc s1 0.13 .005 l q 9.02 0.51 9.53 1.14 .355 .020 .375 .045 n 32 note: although dimensions are in inches, the us government preferred system of measurement is the metric si system. however, since this item was originally designed using inch - pound units of measurement, in the event of conflict between the two, the inch - pound units shall take precedence. metric equivalents are for general information only. this package is manufactured for additional rad tolerant capabilities; contact the vendor for specific information. figure 1. case outline ? continued. standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 21 dscc form 2234 apr 97
case 7 figure 1. case outline ? continued. standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 22 dscc form 2234 apr 97
case 7 variations symbol millimeters inches min max min max a b c d e e1 e2 e3 2.97 .38 0.08 10.26 5.94 0.76 3.63 0.56 0.23 21.08 10.57 11.18 .117 .015 .003 .404 .234 .030 .143 .022 .009 .830 .416 .440 e 1.27 .050 bsc s1 0.13 .005 l q 8.89 0.53 10.41 0.91 .350 .021 .410 .036 n 32 note: although dimensions are in inches, the us government preferred system of measurement is the metric si system. however, since this item was originally designed using inch - pound units of measurement, in the event of conflict between the two, the inch - pound units shall take precedence. metric equivalents are for general information only. this package is manufactured for additional rad tolerant capabilities; contact the vendor for specific information. figure 1. case outline ? continued. standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 23 dscc form 2234 apr 97
device types 01 ? 15 16 ? 19 case outlines x, z, u y w t u m, n,6,7 terminal number terminal symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 nc a16 a15 a12 a7 a6 a5 a4 a3 a2 a1 a0 i/o0 i/o1 i/o2 vss i/o3 i/o4 i/o5 i/o6 i/o7 ce a10 oe a11 a9 a8 a13 a14 nc we vcc --- --- --- --- --- --- --- --- --- --- --- --- nc nc nc nc a16 a15 a12 a7 a6 a5 nc nc nc a4 a3 a2 a1 a0 i/o0 i/o1 i/o2 vss nc i/o3 i/o4 i/o5 i/o6 i/o7 ce a10 oe nc nc nc nc a11 a9 a8 a13 a14 nc nc we vcc nc nc nc a16 a15 a12 a7 a6 a5 a4 a3 a2 a1 a0 i/o0 i/o1 i/o2 vss i/o3 i/o4 i/o5 i/o6 i/o7 ce a10 oe a11 a9 a8 a13 a14 nc nc nc we vcc --- --- --- --- --- --- --- --- a14 a12 a7 a6 a5 a4 a3 a2 a1 a0 i/o0 i/o1 i/o2 vss i/o3 i/o4 i/o5 i/o6 i/o7 ce a10 oe a11 a9 a8 a13 we vcc a15 a16 --- --- --- --- --- --- --- --- --- --- --- --- --- --- rdy/ busy a16 a14 a12 a7 a6 a5 a4 a3 a2 a1 a0 i/o0 i/o1 i/o2 vss i/o3 i/o4 i/o5 i/o6 i/o7 ce a10 oe a11 a9 a8 a13 we res a15 vcc --- --- --- --- --- --- --- --- --- --- --- --- rdy/ busy a16 a14 a12 a7 a6 a5 a4 a3 a2 a1 a0 i/o0 i/o1 i/o2 vss i/o3 i/o4 i/o5 i/o6 i/o7 ce a10 oe a11 a9 a8 a13 we res a15 vcc --- --- --- --- --- --- --- --- --- --- --- --- nc = no connection figure 2. terminal connections . standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 24 dscc form 2234 apr 97
device types 01 -15 mode ce oe we i/o read v il v il v ih d out write v il v ih v il d in standby v ih x x high z write inhibit x x v ih d out or high z write inhibit v ih x x high z write inhibit x v il x d out or high z write inhibit v il v il v il no operation software chip clear v il v ih v il d in software write protect v il v ih v il d in high voltage chip clear v il v h v il v ih v ih = high logic, "1" state, v il = low logic, "0" state. x = logic "don't care" state, high z = high impedance state. v h = chip clear voltage, d out = data out, and d in = data in. device types 16 -19 mode ce oe we res rdy/ busy i/o read v il v il v ih v h high z d out standby v ih x x x high z high z write v il v ih v il v h high z to v ol d in deselect v il v ih v ih v h high z high z write inhibit x x v ih x --- --- write inhibit x v il x x --- --- data polling v il v il v ih v h v ol d out (i/o7) program reset x x x v il high z high z v ih = high logic, "1" state, v il = low logic, "0" state. x = logic "don't care" state, high z = high impedance state. d in = data in, d out = data out, and v h = v cc - 0.5 v to v cc +1.0 v. figure 3. truth table . standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 25 dscc form 2234 apr 97
read mode waveform note: res waveform is applicable to device types 16 - 19 only. figure 4. waveforms . standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 26 dscc form 2234 apr 97
we controlled byte write waveforms note: rdy/ busy , res , and v cc waveforms are applicable to device types 16 - 19 only. figure 4. waveforms - continued. standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 27 dscc form 2234 apr 97
ce controlled byte write waveforms note: rdy/ busy , res , and v cc waveforms are applicable to device types 16 - 19 only. figure 4. waveforms - c ontinued. standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 28 dscc form 2234 apr 97
page write mode cycle waveforms note: rdy/ busy , res , and v cc waveforms are applicable to device types 16 - 19 only. figure 4. waveforms - c ontinued. standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 29 dscc form 2234 apr 97
chip erase waveforms (device types 01 ? 15 only) figure 4. waveforms - continued. standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 30 dscc form 2234 apr 97
notes: 1. v oh and v ol will be adjusted to meet load conditions of table i. 2. use this circuit or equivalent circuit. figure 5. switching load circuit . o standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 31 dscc form 2234 apr 97
table iia. electrical test requirements . 1 / 2 / 3 / 4 / 5 / 6 / 7 / line no. test requirements subgroups (in accordance with mil - std -883, tm 5005, table i) subgroups (in accordance with mil - prf - 38535, table iii) device class m device class q device class v 1 interim electrical parameters (see 4.2) 1, 7, 9 or 2, 8a, 10 1, 7, 9 or 1, 2, 8a, 10 2 static burn - in (method 1015) not required not required required 3 same as line 1 1*, 7* ? 4 dynamic burn - in (method 1015) required required required 5 same as line 1 1*, 7* ? 6 final electrical parameters (see 4.2) 1*, 2, 3, 7*, 8a, 8b, 9, 10, 11 1*, 2, 3, 7*, 8a, 8b, 9, 10, 11 1*, 2, 3, 7*, 8a, 8b, 9, 10, 11 7 group a test requirements (see 4.4) 1, 2, 3, 4**, 7, 8a, 8b, 9, 10, 11 1, 2, 3, 4**, 7, 8a, 8b, 9, 10, 11 1, 2, 3, 4**, 7, 8a, 8b, 9, 10, 11 8 group c end - point electrical parameters (see 4.4) 2, 3, 7, 8a, 8b 1*, 2, 3, 7, 8a, 8b, 9, 10, 11 ? 1, 2, 3, 7, 8a, 8b, 9, 10, 11 ? 9 group d end - point electrical parameters (see 4.4) 2, 3, 7, 8a, 8b 2, 3, 7, 8a, 8b 2, 3, 7, 8a, 8b 10 group e end - point electrical parameters (see 4.4) 1, 7, 9 1, 7, 9 1, 7, 9 1 / blank spaces indicate tests are not applicable. 2 / any or all subgroups may be combined when using high - speed testers. 3 / subgroups 7 and 8 functional tests shall verify the truth table. 4 / * indicates pda applies to subgroup 1 and 7. 5 / ** see 4.4.1 c. 6 / ? indicates delta limit (see table iib) shall be required where specified, and the delta values shall be computed with reference to the previous interim electrical parameters (see line 1). 7 / see 4.4.1 e . table iib. delta limits at +25 c . test 1 / all device types i cc3 standby 10% of specified value in table i i ih , i il 10% of specified value in table i i ohz , i olz 10% of specified value in table i 1 / the above parameter shall be recorded before and after the required burn - in and life tests to determine the delta ? . standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 32 dscc form 2234 apr 97
4. verification 4.1 sampling and inspection . for device classes q and v, sampling and inspection procedures shall be in accordance with mil - prf - 38535 or as modified in the device manufacturer's quality management (qm) plan. the modification in the qm plan shall not affect the form, fit, or function as d escribed herein. for device class m, sampling and inspection procedures shall be in accordance with mil - prf - 38535, appendix a. 4.2 screening . for device classes q and v, screening shall be in accordance with mil - prf - 38535, and shall be conducted on al l devices prior to qualification and technology conformance inspection. for device class m, screening shall be in accordance with method 5004 of mil - std - 883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 additional criteria for device class m . a. delete the sequence specified as initial (preburn - in) electrical parameters through interim (postburn- in) electrical parameters of method 5004 and substitute lines 1 through 6 of table iia herein. b. prior to burn - in, the devices shall be programmed (see 4.5.2 herein) with a checkerboard pattern or equivalent (manufacturers at their option may employ an equivalent pattern provided it is a topologically true alternating bit pattern). the pattern shall be read b efore and after burn - in. devices having bits not in the proper state after burn - in shall constitute a device failure and shall be included in the pda calculation and shall be removed from the lot. c. the test circuit shall be maintained by the manufactu rer under document revision level control and shall be made available to the preparing or acquiring activity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent spec ified in method 1015. (1) dynamic burn - in (method 1015 of mil - std - 883, test condition d; for circuit, see 4.2.1 c herein). d . interim and final electrical parameters shall be as specified in table iia herein. e. after the completion of all screening, the device shall be erased and verified prior to delivery. 4.2.2 additional criteria for device classes q and v . a. the burn - in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufactur er's qm plan in accordance with mil - prf - 38535. the burn- in test circuit shall be maintained under document revision level control of the device manufacturer's technology review board (trb) in accordance with mil - prf - 38535 and shall be made available to th e acquiring or preparing activity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of mil - std - 883. b. interim and final electrical test parameters shall be as specified in table iia herein. c. additional screening for device class v beyond the requirements of device class q shall be as specified in mil - prf - 38535, appendix b. 4.3 qualification inspection for device classes q and v . qualification inspection for device classes q and v shall be in accordance with mil - prf - 38535. inspections to be performed shall be those specified in mil- prf - 38535 and herein for groups a, b, c, d, and e inspections (see 4.4.1 through 4.4.4). 4.4 conf ormance inspection . technology conformance inspection for classes q and v shall be in accordance with mil - prf - 38535 including groups a, b, c, d, and e inspections and as specified herein. quality conformance inspection for device clas s m shall be in acco rdance with mil - prf - 38535, appendix a and as specified herein. inspections to be performed for device class m shall be those specified in method 5005 of mil - std - 883 and herein for groups a, b, c, d, and e inspections (see 4.4.1 through 4.4.4). 4.4.1 gr oup a inspection . a. tests shall be as specified in table iia herein. b. subgroups 5 and 6 of table i of method 5005 of mil - std - 883 shall be omitted. standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 33 dscc form 2234 apr 97
c. subgroup 4 (c in and c out measurements) shall be measured only for initial qualification and after any process or design changes which may affect input or output capacitance. capacitance shall be measured between the designated terminal and gnd at a frequency of 1 mhz. sample si ze is 15 devices with no failures, and all input and output terminals tested. d . for device class m, subgroups 7 and 8 tests shall be sufficient to verify the truth table. for device classes q and v, subgroups 7 and 8 shall include verifying the functionality of the device , these tests shall have been fault graded in accordance with mil - std - 883, test method 5012 (see 1.5 herein). e . o/v (latch - up) tests shall be measured only for initial qualification and after any design or process changes whic h may affect the performance of the device. for device class m, procedures and circuits shall be maintained under document revision level control by the manufacturer and shall be made available to the preparing activity or acquiring activity upon request. for device classes q and v, the procedures and circuits shall be under the control of the device manufacturer's trb in accordance with mil - prf - 38535 and shall be made available to the preparing activity or acquiring activity upon request. testing shall be on all pins, on five devices with zero failures. latch - up test shall be considered destructive. information contained in jesd78 may be used for reference. f. all devices selected for testing shall be programmed with a checkerboard pattern or equival ent. after completion of all testing, the devices shall be erased and verified, (except devices submitted for groups c and d testing). 4.4.2 group c inspection . the group c inspection end - point electrical parameters shall be as specified in table iia herein. delta limits shall apply to group c and shall consist of test s specified in table iib herein. 4.4.2.1 additional criteria for device class m. a. steady - state life test conditions, method 1005 of mil- std - 883: (1) the device selected for testing shall be programmed with a checkerboard pattern. after completion of all testing, the devices shall be erased and verified (except devices submitted for group d testing). (2) test condition d or e. the test circuit sha ll be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005. (3) t a = +125 c, minimum. (4) test duration: 1,000 hours, except as specified in method 1005 of mil - std -883. b. all devices requiring end - point electrical testing shall be programmed with a checkerboard or equivalent alternating bit pattern. c. after the completion of all testing, the devices shall be cleared and verified prior to delivery. 4.4.2.2 additional criteria for device classes q and v . the steady - state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's qm plan in accordance with mil - prf - 38535. the test circuit shall be maintained under document revision level control by the device manufacture r's trb in accordance with mil - prf - 38535 and shall be made available to the acquiring or preparing activity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent speci fied in method 1005 of mil - std -883. 4.4.3 group d inspection . the group d inspection end - point electrical parameters shall be as specified in table iia herein. the devices selected for testing shall be programmed with a checkerboard pattern. after co mpletion of all testing, the devices shall be erased and verified. 4.4.4 group e inspection . group e inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. end - point electrical parameters shall b e as specified in table iia herein. standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 34 dscc form 2234 apr 97
b. for device classes q and v, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in mil - prf - 38535 for the rha level being tested. for device class m, the devices shall be subjected to radiation hardness assured tests as specified in mil - prf - 38535, appendix a for the rha level being tested. all device classes must meet the postirradiation end - point electrical parameter limits as defined in table i at t a = +25 o c 5 o c, after exposure, to the subgroups specified in table iia herein. 4.5 methods of inspection . methods of inspection shall be as specified in the appropriate figures and tables herein. 4.5.1 erasing procedures . the erasing procedures shall be as specified by t he device manufacturer and shall be available upon request. 4.5.2 programming procedure . the programming procedures shall be as specified by the device manufacturer and shall be made available upon request. 4.5.3 software data protect procedures . the software data protect procedures shall be as specified by the device manufacturer and shall be made available upon request. 4. 6 delta measurements for device class v . delta measurements, as specified in table iia, shall be made and recorded before and after the required burn - in screens and steady - state life tests to determine delta compliance. the electrical parameters to be measured, with associated delta limits are listed in table iib. the device manufacturer may, at his option, either perform delta measurements or within 24 hours after burn - in perform final electrical parameter tests, subgroups 1, 7, 9. 5. packaging 5.1 packaging requirements . the requirements for packaging shall be in accordance with mil - prf - 38535 for device classes q and v o r mil - prf - 38535, appendix a for device class m. 6. notes 6.1 intended use . microcircuits conforming to this drawing are intended for use for government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 replaceability . microcircuits covered by this drawing will replace the same generic device covered by a contractor prepared specification or drawing. 6.1.2 substitutability . device class q devices will replace device class m devices. 6.2 con figuration control of smd's . all proposed changes to existing smd's will be coordinated with the users of record for the individual documents. this coordination will be accomplished using dd form 1692, engineering change proposal. 6.3 record of users . military and industrial users should inform dla land and maritime when a system application requires configuration control and which smd's are applicable to that system. dla land and maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. users of drawings covering microelectro nic devices (fsc 5962) should contact dla land and maritime - va, telephone (614) 692- 8108 . 6. 4 comments . comments on this drawing should be directed to dla land and maritime - va, columbus, ohio 43218 - 3990, or telephone (614) 692 - 0540 . 6.5 abbreviations, symbols, and definitions . the abbreviations, symbols, and definitions used herein are defi ned in mil - prf - 38535 and mil- hdbk - 1331 , and as follows: c in , c out ................ input and bidirectional output, terminal -to - gnd capacitance. gnd ....................... ground zero voltage potential. i cc .......................... supply current. i il ............................ input current low. i ih ........................... input current high. t c ........................... case tempe rature. t a ........................... ambient temperature. v cc ......................... positive supply voltage. v h ........................... output enable and write enable voltage during chip erase. o/v ......................... latchup over - voltage. standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 35 dscc form 2234 apr 97
6.5.1 timing limits . the table of timing values shows either a minimum or a maximum limit for each parameter. input requirements are specified from the external system point of view. thus, address setup time is shown as a minimum since the system must supply at least that much time (even though most devices do not require it). on the other hand, responses from the memory are specified from the device point of view. thus, the access time is shown as a maximum since the device never provides data later than that time. 6.5.2 timing parameter abbreviations . all timing abbreviations use lower case characters with upper case subscripts. the initial character is always "t" and is followed by four descriptors. these characters specify two signal points arranged in a "from - to" sequence that define a timing interval. the two descriptors for each s ignal specify the signal name and the signal transition. thus the format is: t x x x x ? ? ? ? ? ? ? ? signal name from which interval is defined ? ? ? ? ? ? ? transition direction for first signal ? ? ? ? ? signal name to which interval is defined ? ? ? transition direction for second signal ? a. signal definitions: b. transition definitions: a = address h = transition to high d = data in l = transition to low q = data out v = transition to valid w = write enable x = transition to invalid or don't care e = chip enable z = transition to off (high impedance) g = output enable 6.5. 3 waveforms . waveform symbol input output must be valid will be valid change from h to l will change from h to l change from l to h will change from l to h don't care any change permitted changing state unknown high impedance 6.6 sources of supply . 6.6.1 sources of supply for device classes q and v . sources of supply for device classes q and v are listed in mil - hdbk - 103 and qml- 38535. the vendors listed in qml - 38535 have submitted a certificate of compliance (see 3.6 herein) to dla land and maritime - va and have agreed to this drawing. 6.6.2 approved sources of supply for device class m . a pproved sources of supply for class m are listed in mil- hdbk - 103. the vendors listed in mil - hdbk - 103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by dla land and maritime -va. standard microcircuit drawing size a 5962-38267 dla land and maritime columbus, ohio 43218 - 3990 revision level j sheet 36 dscc form 2234 apr 97
standard microcircuit drawing bulletin date: 14-12- 10 approved sources of supply for smd 5962 - 38267 are listed below for immediate acquisition information only and shall be added to mil - hdbk - 103 and qml- 38535 during the next revision. mil- hdbk - 103 and qml- 38535 will be revised to include the addition or deletion of sources. the vendors listed below ha ve agreed to this drawing and a certificate of compliance has been submitted to and accepted by dla land and maritime - va. this information bulletin is superseded by the next dated revision of mil - hdbk - 103 and qml- 38535. dla land and maritime -va maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/programs/smcr/ . standard microcircuit drawing pin 1 / vendor cage number vendor similar p in 2 / 5962 - 3826701mxa 3 / 57300 3 / 3 / at28c010 - 25 d m/883 as28c010cw -25 x28c010dmb - 25 cm28c010 - 250 5962 - 3826701mya 0hsw3 3 / at28c010 - 25lm/883 lm28c010 - 250 5962 - 3826701mza 0hsw3 57300 3 / 3 / at28c010 - 25fm/883 as28c010f -25 x28c010fmb - 25 fm28c010 - 250 5962 - 3826701mzc 3 / 28c010 - 25 5962 - 3826701mta 0hsw3 at28c010 - 25um/883 5962 - 3826701mua 0hsw3 at28c010 - 25em/883 5962 - 3826701mwc 3 / 3 / x28c010kmb -25 tm28c010 -250 5962 - 3826702mxa 3 / cm28c010h - 250 5962 - 3826702mya 3 / lm28c010h - 250 5962 - 3826702mza 3 / fm28c010h - 250 5962 - 3826702mwa 3 / tm28c010h - 250 5962 - 3826703mxa 3 / 3 / 3 / 57300 at28c010 - 20 d m/883 x28c010dmb - 20 cm28c010 - 200 as28c010cw -20 5962 - 3826703mya 0hsw3 3 / at28c010 - 20lm/883 lm28c010 -200 5962 - 3826703mza 0hsw3 3 / 3 / 57300 at28c010 - 20fm/883 x28c010fmb - 20 fm28c010 -200 as28c010f - 20 5962 - 3826703mzc 3 / 28c010 - 20 5962 - 3826703mta 0hsw3 at28c010 - 20um/883 5962 - 3826703mua 0hsw3 at28c010 - 20em/883 5962 - 3826703mwc 3 / 3 / x28c010kmb -20 tm28c010 - 200 5962 - 3826704mxa 3 / cm28c010h - 200 5962 - 3826704mya 3 / lm28c010h - 200 5962 - 3826704mza 3 / fm28c010h - 200 5962 - 3826704mwa 3 / tm28c010h - 200 see footnotes at end of table. 1 of 4
standard microcircuit drawing bulletin ? continued. date: 14 -12- 10 standard microcircuit drawing pin 1 / vendor cage number vendor similar pin 2 / 5962 - 3826705mxa 3 / 57300 3 / 3 / at28c010 - 15 d m/883 as 28c010cw -15 x28c010dmb - 15 cm28c010 - 150 5962 - 3826705mya 0hsw3 3 / at28c010 - 15lm/883 lm28c010 - 150 5962 - 3826705mza 0hsw3 3 / 3 / 57300 at28c010 - 15fm/883 x28c010fmb - 15 fm28c010 -150 as28c010f -15 5962 - 3826705mzc 3 / 28c010f - 15 5962 - 3826705mta 0hsw3 at28c010 - 15um/883 5962 - 3826705mua 0hsw3 at28c010 - 15em/883 5962 - 3826705 mwc 3 / 3 / x28c010kmb -15 tm28c010 - 150 5962 - 3826706mxa 3 / cm28c010h - 150 5962 - 3826706mya 3 / lm28c010h - 150 5962 - 3826706mza 3 / fm28c010h - 150 5962 - 3826706mwa 3 / tm28c010h - 150 5962 - 3826707mxa 3 / 57300 3 / 3 / at28c010 - 12 d m/883 as 28c010cw -12 x28c010dmb - 12 cm28c010 - 120 5962 - 3826707mya 0hsw3 3 / at28c010 - 12lm/883 lm28c010 - 120 5962 - 3826707mza 0hsw3 3 / 3 / 57300 at28c010 - 12fm/883 x28c010fmb - 12 fm28c010 -120 as28c010f -12 5962 - 3826707mzc 3 / 28c010f - 12 5962 - 3826707mta 0hsw3 at28c010 - 12um/883 5962 - 3826707mua 0hsw3 at28c010 - 12em/883 5962 - 3826707mwc 3 / 3 / x28c010kmb -12 tm28c010 - 120 5962 - 3826716qua 57300 as58c1001eca - 25/883c 5962 - 3826716qma 57300 as58c1001f - 25/883c 5962 - 3826716q m c 68911 28c010tfb - 25 5962 - 3826716vmc 68911 28c010tf s - 25 5962 - 3826716qna 57300 as58c1001sf - 25/883c 5962 - 3826716q6c 68911 28c010trpfb - 25 5962 - 3826716v6c 68911 28c010trpf s - 25 5962 - 3826716q7c 68911 28c011trpfb - 25 5962 - 3826716v7c 68911 28c01 1 trpf s - 25 see footnotes at end of table. 2 of 4
standard microcircuit drawing bulletin ? continued. date: 14 -12- 10 standard microcircuit drawing pin 1 / vendor cage number vendor similar pin 2 / 5962 - 3826717qua 57300 as58c1001eca - 20/883c 5962 - 3826717qma 57300 as58c1001f - 20/883c 5962 - 3826717q m c 68911 28c010tfb - 20 5962 - 3826717vmc 68911 28c010tf s - 2 0 5962 - 3826717qna 57300 as58c1001sf - 20/883c 5962 - 3826717q6c 68911 28c010trpfb - 20 5962 - 3826717v6c 68911 28c010t rp f s - 2 0 5962 - 3826717q7c 68911 28c011trpfb -20 5962 - 3826717v7c 68911 28c01 1 t rp f s - 2 0 5962 - 3826718qua 57300 as58c1001eca - 15/883c 5962 - 3826718qma 57300 as58c1001f - 15/883c 5962 - 3826718q m c 68911 28c010tfb - 15 5962 - 3826718 vm c 68911 28c010tf s - 15 5962 - 3826718qna 57300 as58c1001sf - 15/883c 5962 - 3826718q6c 68911 28c010trpfb - 15 5962 - 3826718 v6 c 68911 28c010t rp f s - 15 5962 - 3826718q7c 68911 28c011trpfb - 15 5962 - 3826718 v7 c 68911 28c01 1 t rp f s-15 5962 - 3826719qmc 68911 28c010tfb - 12 5962 - 382671 9vm c 68911 28c010tf s - 1 2 5962 - 3826719q6c 68911 28c010trpfb - 12 5962 - 382671 9v6 c 68911 28c010t rp f s - 1 2 5962 - 3826719q7c 68911 28c011trpfb - 12 5962 - 382671 9v7 c 68911 28c01 1 t rp f s - 1 2 1 / the lead finish shown for each pin representing a hermetic package is the most readily available from the manufacturer listed for that part. if the desired lead finish is not listed contact the vendor to determine its availability. 2 / caution . do not use this number for item acquisition. items acquired to this n umber may not satisfy the performance requirements of this drawing. 3 / not available from an approved source of supply. 3 of 4
standard microcircuit drawing bulletin ? continued. date: 14 -12- 10 vendor cage number vendor name and address 0hsw3 atmel corporation 1150 east cheyenne mtn . blvd. colorado springs, co 80906 57300 micross components 7725 n. orange blossom trail orlando , fl 32810 - 2696 68911 maxwell technologies 9244 balboa avenue san diego, ca 92123 the information contained herein is disseminated for convenience only and the government assumes no liability whatsoever for any inaccuracies in the information bulletin. 4 of 4

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